News Huawei Turns To 3D Chip Stacking To Evade US Sanctions

[Admin]

Huawei is betting on advanced chip packaging to counter U.S. chip sanctions.

Huawei Turns To 3D Chip Stacking To Evade US Sanctions : Read more

 

[derekullo]

Huawei has mastered horizontal Lego stacking!

Congratulations!

 

[jkflipflop98]

The author of this article is mistaken. F2F (face to face) stacking methods are nothing new. Their problem is they have incredible heat buildup as all the thermals are contained inside of a tiny strip that's sandwiched in between the silicon substrates of the die. It acts like a blanket keeping the heat inside. Terrible for thermals and that's why no one else does this.

 

[KananX]

It’d strange if they could circumvent the export restrictions with this, but if yes, kudos to them for their creativity. The export restrictions don’t make much sense anyway.

 

[Kamen Rider Blade]

Good luck with cooling that sucker.

You have Heat trapped in the center and heat on both sides of the chips.

That's going to be a unnecessarily complex die to cool.

 

[KananX]

Good luck with cooling that sucker.

You have Heat trapped in the center and heat on both sides of the chips.

That's going to be a unnecessarily complex die to cool.

Probably just a flagship chip but who knows.