IC Diamond Test Results

[Darshebag]

Honestly cmc, how on earth is that sarcasm? lol You hurt my feelings! (joking)

 

[cmcghee358]

You'll see. Around here people talk mad trash about the H50, and anyone who uses one. It's really weird.

 

[Darshebag]

Ironically you were the first one yet that I have heard... lol. H50 is ok in my book. We'll see who's laughing when I buy a mini fridge for sodas on Amazon for 30 bucks and get negative C temps by putting the radiator in there lol Anyone tried that yet? The idea sounds plausible to me...

 

[cmcghee358]

JUst realize that when your temp drops too low it will condense water on your socket and possibly fry your motherboard.

As for the H50 hate? http://www.tomshardware.com/forum/forum2.php?config=tomshardwareus.inc&cat=28&post=279815&page=1&p=1&sondage=0&owntopic=1&trash=0&trash_post=0&print=0&numreponse=0&quote_only=0&new=0&nojs=0

 

[mindless728]

JUst realize that when your temp drops too low it will condense water on your socket and possibly fry your motherboard.

As for the H50 hate? http://www.tomshardware.com/forum/forum2.php?config=tomshardwareus.inc&cat=28&post=279815&page=1&p=1&sondage=0&owntopic=1&trash=0&trash_post=0&print=0&numreponse=0&quote_only=0&new=0&nojs=0

the reason for so much hate is the price compared to a good air cooler with 120mm fans, ie $80 H50 or the $40 Hyper 212+

this Hyper 212+ is actually $30

 

[Darshebag]

Jeeesus... We had better be careful. After reading that forum it would be wise to never speak of my H50 again... Some people go ape5)&# over nothing. dam

Those mini fridges on Amazon probably won't get too cold. I'll start up a new thread when I get my mini fridge. XD

I think I may be able to find one that can be powered by DC and is small enough to fit in my case!

Anyways, lets get back on topic... Sorry I hijacked this thread.

 

[lcp1109]

After 30 mn's of prime's bleeding test I get:

57-58ºC with Revoltec Thermal Grease Diamond

and 52-53ºC with IC Diamond

Phedom x4 550@ 3.6MHz
Xigmatec Red Scorpion
dont know the room's temperature, but during tests there was no change on the HHD temperature.
board's temperature was at 30-31ºC before test, and 32-34ºC after test

HD 5770 test:
with original thermal compund: 92.5ºC (playing COD: MWF 2), 49ºC Idle
with IC Diamound 80ºC (playing COD: MWF 2); 46º Idle

 

[Darshebag]

After 30 mn's of prime's bleeding test I get:

57-58ºC with Revoltec Thermal Grease Diamond

and 52-53ºC with IC Diamond

Phedom x4 550@ 3.6MHz
Xigmatec Red Scorpion
dont know the room's temperature, but during tests there was no change on the HHD temperature.
board's temperature was at 30-31ºC before test, and 32-34ºC after test

HD 5770 test:
with original thermal compund: 92.5ºC (playing COD: MWF 2), 49ºC Idle
with IC Diamound 80ºC (playing COD: MWF 2); 46º Idle

Nice, but looks like the 5770 could use the paste as well.. Also try adding fans.

 

[Darshebag]

Doh... I mean maybe just add some fans. Now I notice that you already saw a temp drop with IC Diamond on the 5770.

 

[lcp1109]

Doh... I mean maybe just add some fans. Now I notice that you already saw a temp drop with IC Diamond on the 5770.

I have a 140mm side fan over it

 

[eloric]

Update on the requested observation regarding abrasiveness of the compund: today I removed CoolerMaster and replaced it with the ThermalRight. Noticed after removing the IC diamond that the laser etched lettering was much fainter than before. This would be the fourth time that I have removed thermal compound - twice with generic paste, and twice with the IC Diamond. This emperical evidence supports your advisory.

 

[ashkaji]

Abbrasion aside this is a good product. I think ill use it on equipment thats past warranty though. Seems like an ideal tim for lapped surfaces, just to get that polish effect between each surface.

 

[Forte125]

Abient: 25

Artic Silver 5
Load (Mass Effect): 57
Idle:33

Stock
Load (Mass Effect):62
Idle: 39

IC Diamond
Load (Mass Effect): 54
Idle: 32

 

[eloric]

Abbrasion aside this is a good product. I think ill use it on equipment thats past warranty though. Seems like an ideal tim for lapped surfaces, just to get that polish effect between each surface.

Maybe some care in removing it to make sure you are applying even pressure across the entire surface to avoid dips or grooves.

Just to make it clear, even though you can barely read the lettering on my CPU now, that would not stop me from using this product on any chip or heatsink in the future. Simply put, I am hooked, and will be spending money on IC Diamond in the future.

 

[BorNej]

I will post my results soon, I'm going to do a second application just to check the contact spread. I have a H50 cooler so it's tricky to apply correctly.

 

[gothicfighter]

The CPU is cooler then the results shown in the first result. I even got temps as low as 30*C at startup.

 

[cmcghee358]

I think you have found some really old application instructions infotechproximity8.

Now it's just a pea size bead and have pressure from the HSF installation disperse it.

 

[IC Diamond]

I think you have found some really old application instructions infotechproximity8.

Now it's just a pea size bead and have pressure from the HSF installation disperse it.

Mostly right it was more for getting it out of the tube in the winter months where with cooler temps the compound viscosity goes up. Some people have the ambient room environment down to 15C or they may take it out of the mailbox at subzero temps.

Also recommended, just putting it in your pocket or on a piece of electronics equipment, hairdryer, anything to bring up the temp a few degrees

 

[gothicfighter]

I've applied mine with no problems at all. Just pressed the syringe hard, applied a 5mm ball of paste and the HSF pressure did the job. Now I'm running my unlocked 555 @50*C in an old case witch will be replaced by an Antec 200. I'll bet the temps will drop even more.
Thanks again IC!

 

[cmcghee358]

I recently lapped my CPU and HSF and I noticed that I didn't have full coverage on my CPU of the IC Diamond 24 TIM.

See this blurry annoying picture for a rough idea.

I obviously had a matching ring on my H50 thermal mating surface. I don't think it was "ground in" so much as just dirtying up the CPU surface. But either way I lapped it all off. I believe most of it disappeared with isopropyl alcohol.

So I think the moral of my story is, because the TIM is so thick and tough you really need to push down on your HSF to get it to actually disperse across the entire surface.

Although I will say that when I lapped my CPU it was fairly obvious that it had a substantial "bowl" depression in the middle. That also could have contributed to the TIM's dispersement across the surface.

 

[BorNej]

First application

Temps coretemp 99.5 and hw moniter four values averaged from each then averaged between the two

Before IC24 with Ultra TIM ambient 75F

idle:40c load:66c

After IC24 ambient 75F

idle:37.75c load:61c

-idle:2.25c -load:5c

temps LCD Poster ambient 75F

before IC24 with Ultra TIM

idle:40c load:65c

After IC24 amient 75F

idle:36.25c load:61c

-idle:3.75c -load:4c


Second application(results coming soon) I will edit this post when I have the second results and pics of the spread as well.

 

[Shadow703793]

Although I will say that when I lapped my CPU

That isn't what I would call lapping imo.

 

[cmcghee358]

That was the before picture Shadow...

I wanted to show the dispersement of the TIM right after the HSF was removed to highlight the importance of proper force to adequately spread the TIM out, because it's more solid compared to AS5 for example.

 

[IC Diamond]

I will participate. I will send you a pm with my address(again, to make it easier). I highly embrace businesses that support and improve upon their product.

On it's way you should have it in a day or two I will PM you with instructions

 

[IC Diamond]

That was the before picture Shadow...

I wanted to show the dispersement of the TIM right after the HSF was removed to highlight the importance of proper force to adequately spread the TIM out, because it's more solid compared to AS5 for example.

Intel has a Flatness spec of .002+/-//(parallel)

This can be some what problematic for people that like to improve their temps and why lapping can sometimes improve temps several degrees.

being flat is most important.




Figure #1 is an idealized contact.

Sink and IHS are perfectly flat. With proper pressure and heat the paste flows and the gap separating sink and IHS closes or resolves down to the average particle size - the size of the particle determines the ultimate bond line thickness (BLT) Smaller the gap the better the performance in conjunction with material thermal conductivity determines performance. My experience is that too much paste will not affect performance -excess is just forced out

Figure # 2 is an illustration of the interference of high spots between the mating surfaces.

If the high spot is the same height or higher as the particle thickness, Particles on top of that high spot will add a whole new layer of compound to the interface, 2X -4x the amount of paste in the BLT increasing the resistance and negatively impacting performance - Flatness is the first priority when seeking best performance.

Flatness again is most important to getting the most out of you system, a max of 600 grit is kind of the limit I have not seen much improvement beyond that as the compound particle size is generally larger than the polishing imperfections.

Although some people really like a good lap job