As a former tech support employee for a large OEM it was not uncommon for partial memory replacements to have problems and more ram having to be sent out to get sticks to work together. Also the systems built with mismatched sets in the factory are tested before leaving the factory as part of QC, so technically they do end up being tested together before being sold. Usually the higher end systems did use matched sets and were also replaced with matched sets.
Mismatched sets can work just fine, but they can also be problematic which is why most recommend just using matched sets as the best practice.
This mirrors what I've said. There can be issues, yes, and in general it is not recommended but they can, and do, work together. This post inadvertently supports my assertion. It also proves
Intel's and AMD's Flex mode specifications correct.
Some further reading on this. Before you even go to cite this link as refutation I will quote what I believe will be cited:
There are no guarantees that any DRAM you buy will play well with what you already have.
Yes, no guarantees but they can work together. I've never disputed this.
It lets you use DRAM of different capacities to enable the exploitation of the motherboard’s multi-channel architecture whenever possible.
Ram can be VERY finicky, and in many situations not using a matched set results in a system that either is not stable or doesn't boot at all. Thats what he was referring to. If you want your best chance of it working and not being stuck with ram that you can't use you need to either buy a matched set, or at a minimum buy the identical DIMM to what you have. For example if you try to run a Samsung and a Hynix DIMM in the same system in most cases it won't work at all.
I see some contradictions. Flex mode lets you use unmatched size sticks which implies they're not matched sets even if they're simply different composition (dual vs single rank). 👍
Where I've personally seen issues is when the sticks deviated from JEDEC standards (faster/lower latency), the IMC of the CPU was very poor quality (a rare few being the cause of repair in the first place), issues with the BIOS (corruption/support) and/or chipset IMC (if it has one like older boards), and finally when there was an issue with the replacement stick itself (DOA/faulty/manufacturing defects that make them more difficult for the IMC to deal with).
Nowhere have I said that you should mismatch sticks. I've clearly stated many times that you should, in fact, buy a "matched" set. Where my contention is with the assertion that they do not work. Yes, we can both agree that there's situations where they can have issues but you must admit that they can work. This is the entire basis of my original argument. Matched kits are suggested but not, necessarily, required.
I'm not going to line by line it either, I will however do this. This, which is only ONE example, by a member that is no longer with us (Literally), who probably knew more about memory and memory architectures than anybody, BAR NONE, that frequents this forum aside from probably Pinhedd and Invalid error, that completely refutes just about everything in that diatribe of nonsense.
That is found here:
https://www.tomshardware.com/reviews/ddr-dram-myths,4155.html#p1 in an ACTUAL article, by a guy who ACTUALLY knows what he is talking about.
Quoted article further proves my point. They're not guaranteed to work and even the points made in the article can happen to "matched" sticks. Again:
In fact, most manufacturers only warrant that their kits were tested to work together. Not that they will work together on everything. This is why QVL's exist in the first place as they're tested by the manufacturer to ensure that the kit does work on the system (even if cherry picked by RAM manufacturers for DDR4-3866+ kits).
More specifically in that article it is talking about when the sticks deviate from JEDEC standards.
Because some DRAM manufacturers decided to exceed the JEDEC maximum
When you deviate from the standards is when issues arise. It takes carefully selected ICs to achieve speeds above the JEDEC spec of DDR4-2133. These ICs are all combined per-stick and usually per-batch to ensure they perform similarly but is not necessarily a requirement. This is why any RAM kit installed in a Ryzen system that is sold to run at any speed above DDR4-2133 can have issues. Even then, as I've pointed out, there are further restrictions to these speeds that are explicitly outlined by AMD themselves. For example:
Looking at the chart in the link it appears that four sticks of dual-rank memory, which results in DDR4-1866, will be the hardest to overclock due to the IMC. This is not because the "Ram can be VERY finicky" but because the IMC itself is finicky.
I assume you've seen the threads on this forum about Ryzen and RAM compatibility. Under this assumption you should be readily aware of the issues of perfectly good RAM kits not working with specific CPUs or motherboards. How many of these threads say "Works at DDR4-2133 but not at the rated speed"/"when XMP enabled"? Why is there a
stickied thread explicitly outlining how to get your RAM to run at a certain speed or its XMP and explicitly goes in to Ryzen having issues? Is it because the RAM doesn't work with the CPU or is it the CPU's IMC that doesn't work with the RAM? 🤔
Not to mention, my Anecdotal evidence, both from working on and building systems these past 30 years, and working this forum for the last five,
I can dismiss your anecdotal evidence just as readily as you've dismissed mine in your message quoted further below. Yes, mixing RAM is problematic as I've said but it does work and is why Intel and AMD support features specifically for this in their CPU's IMC.
that monologue upstairs is pile of garbage based not on reality, but one person's limited experience on a few systems that didn't happen to encounter any issues. And that basically amounts to the same thing as a grain of sand flicked into the ocean in the grand scheme of things.
What's that one saying when you assume? You're doing that right now. Perhaps you may not have noticed this part:
these are the ones I remember off the top of my head
You don't know what I do and are clearly assuming that I have very limited experience with computers to the point of being "a grain of sand flicked into the ocean in the grand scheme of things." Very belittling and rude language from a moderator.
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I suggest you try simply stating that you dispute the information instead of resorting to being rude or impolite.
@InvalidError is exactly right. 👍
And this right here shows exactly my point.
Bulk ram from the same supplier still came from the same batch,
Nope. It's likely but not guaranteed.
LOL
from the same slabs of silicon.
Can be likely but only if the number of sticks purchased in bulk are smaller than or match a single slab of silicon and even then this isn't guaranteed. The orders that I mentioned would amount to multiple slabs of silicon with all the sticks placed in bulk storage packaging after final assembly which further mixes them.
So chances are it will work together.
Yes, so long as they adhere to JEDEC's specifications.
But 2 different dimms, of different specs, or even the same model but ordered at a completely different time did not come from the same batch,
Of course there's no guarantee of this.
maybe not even the same machine,
Did you know that many fabs have multiple machines? More machines results in higher output and having multiple machines running so that other longer processes can be ran in parallel further increases throughput but at the cost of there being more machines.
heck it may even be different brand chips (Corsair, Gskill, etc use both Samsung and Hynix and sometimes mid production change them).
Less likely, especially for the very high end like DDR4-3200C14 that are exclusively Samsung B-Die. Usually when they switch the chips it will receive a different model number. This is especially important for tech support, RMA, and warranty services.
Hence... maybe {it wont} work.
Of course. I never guaranteed they would work. If they conformed to JEDEC spec then it is highly likely to work but there's many other factors, that I've already outlined and have been linked to, that could contribute to them not working.
I see some others have chimed in with more than enough proof. Me, I literally used to work for Veeco, they make the machines that all these manufacturers use to make DRAM chips. So again, tell me how your anecdotal evidence based on an extremely minor sample set is better than the multitude of proof presented to you? Does this sample set use the same logic you use for testing CPUs against each other without a GPU bottleneck?
I can dismiss your anecdotal evidence just as readily as you've dismissed mine. Working for the factory that makes the machines isn't the same as working for the factory that verifies the end product the machines create. There's a multitude of proof here that contradicts what you claim. This proof includes the very posts you've mentioned here that you claim refute what I've said. I'll continue to be a broken record: "There can be issues, yes, and in general it is not recommended but they can, and do, work together." I will point out that this statement does not guarantee that the kit will run at a specific speed or set of timings. It simply states that they can work together.
I'm having fun with this conversation.