I know Intel talked about this first at the last IDF ... but I don't know if they demonstrated a working version before.
Intel Teraflop Chip
Intel Teraflop Chip
A little old news, but noteworthy nonetheless. Someone pointed to Charlie's article and his take on it, and Charlie is correct in saying it doesn't really do much.... what it does do how ever is provide a proof of concept, an 80 core network capable of over 1 TB of bandwidth.... this is done with dedicated SRAM stack on top of the chip using through silicon via technology.
In the end the 80 core chip doesn't do much but what it does do is show that a massively parallel, tile system can work and that the technology can be made to feed it data fast enough. This is the exciting part.
Imagine a chip with 16 tiles geared toward graphics, each tile capable of 8 shader operations per cycle, need more then bump that to 32 tiles, need even more? Bump it to 64 tiles.... you begin to see where this is going. Now, imagine a chip capable of putting say 64 tiles in parallel, each tile capable of calculating 8 ray traces to completion in say 10 cycles (just pulling crap out of the air as an example).... the concept of realtime ray trace rendering is not too far fetched.
Jack
Keep in mind, these are very simple cores - not full x86 cores. Intel is focusing on how they are networked together. The fundamentals of which, I'm sure will make it's way to x86 implementation, but Intel is saying not to look for this tech to be marketable for another 5-10 years.
I heard something about revearse hyperthreading a while back. A bunch of cores on a cpu will work like a single core if a program isnt built for multiple cores. Sounds like a good idea, that way you can harness the full potential of your proc in a non-multi threaded app. It could be put towards alot of good use in an 80 core cpu.
If stacked tiles/cores is the future AMD may be in trouble. I'm sure Intel has filled patents for all the technology and concepts in this 80 core processor.
There are a lot of new (good) ideas in that piece of silicon.
AMD is hard at work with the tiled/copy-paste methodology already.
If stacked tiles/cores is the future AMD may be in trouble. I'm sure Intel has filled patents for all the technology and concepts in this 80 core processor.
There are a lot of new (good) ideas in that piece of silicon.
The difference between fusion here and the 80 core project is that Intel's 80 core project is designed to test the extremes not just from how many cores, but how to connect them up to work together and shuttle a lot of data/info. We have not seen something like this from AMD yet, but it has to happen.... moving to a parallel universe in a hetrogeneous manner will require some heavy lifting in the interconnect fabric to supply the necessary BW, otherwise a massively cored device will find many cores simply idling and defeats the purpose.
Jack
If stacked tiles/cores is the future AMD may be in trouble. I'm sure Intel has filled patents for all the technology and concepts in this 80 core processor.
There are a lot of new (good) ideas in that piece of silicon.