This commentary is pretty funny. In the future this will happen and that will happen.I am sure again this just another marketing ploy of intel that is ahead of the actual science. What part of the chip is 22nm? It is the cut between the features that make up a transistor. ? Hmmm. I have to tell you that the stuff has to come alot bigger to connect to anything useful. I am pretty sure many of the transistors are alot bigger.
I quote //Jonathan Kang, CPU Designer
Those are typically the feature size. That is to say, it is the smallest "cut" that the fabrication method can make into the silicon. If one were to carve out a transistor on the surface of a silicon wafer, one has to be able to etch to a certain degree of precision. If the smallest cut you can make into the silicon is, say, 11nm, then in order to make a piece of a transistor, you'll need to cut a small square (really a dot) and then leave a space for the next cut.
This means the smallest effective "feature" that can be made is 22nm. For a typical MOSFET (field effect transistor), this size is usually the length of the gate. See the background of a MOSFET:
http://en.wikipedia.org/wiki/MOSFET
In practice, a smaller feature size means smaller transistors can be carved onto silicon. Smaller transistors require less voltage to operate and therefore, use less power. It used to be that smaller transistors also meant they were faster, but that has stopped being true since ~45nm.//
There is more. The problem is doping. They don't talk about that. How do they get each area to be a different material? Ok it is layered with all the layers and then the other layers are removed to make up the transistors. The chip is layered. The thing is, can reliably insulate the area between each transistor as they get smaller cuts?. What will be the failure rate?
The CEOs and other idiots think its just going to go down to 14nm between features. Coughs B.S. I am pretty sure they will lie either way.