[quotemsg=20379114,0,1510138]It's easy to assume that we will eventually see 3D XPoint packages tied together into heterogeneous packages with Intel's EMIB technology[/quotemsg]
You mean embedded in-package with CPUs? Maybe for mobile, but 3D XPoint is still much slower than DRAM. So, they might as well keep it outside the package, where you can fill up the DIMM slots with a lot more of it.
What I'm excited to see coming to an EMIB near you is HBM2. That would be very complementary with 3D XPoint DIMMs. Perhaps this is what Intel is planning with the SoC that will embed the AMD GPU, since NV memory is also great for mobile.