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Archived from groups: comp.sys.ibm.pc.hardware.chips, comp.sys.intel (More info?)
SiliconStrategies.com - Intel 'dual-core' could be two die glued
together, says report
http://www.siliconstrategies.com/article/showArticle.jhtml?articleId=55301654
SiliconStrategies.com - Intel 'dual-core' could be two die glued
together, says report
http://www.siliconstrategies.com/article/showArticle.jhtml?articleId=55301654
LONDON - The planned dual-core processor from Intel Corp.
known as Smithfield could start out as two Pentium 4 chips in a single
package, according to a report that appeared online Tuesday (Dec 14.).
According to the report in The Register, which appeared as Intel held a
telephone press conference to discuss its dual-core processor which is
expected to ship mid-2005, a company executive did not deny the
suggestion that Smithfield would be based on two Pentium 4 processors
glued together in a single package.
Smithfield would initially be fabbed using a 90-nanometer manufacturing
process, but would migrate to a 65-nm process in 2006, the report
quoted Steve Smith, vice president for Intel's desktop platforms group,
as saying.
By the end of 2006 Intel expects over 70 per cent of its desktop CPU
production to be dual-core chips, Smith also said, according to the
report.
The report said Smith declined to comment on whether Smithfield is one
ot more chips in a single package and would only say that Smithfield
contains two execution cores. Smithfiields is expected to operate at a
lower clock frequency than a single P4.