Rare metal solder is very expensive, increases mechanical stresses from thermal cycling materials with different thermal expansion coefficients to which IB is likely more vulnerable due to higher aspect ratio, requires extra preparation (plating wafers and IHS with a compatible metal for soldering) and probably has a few more manufacturing inconvenients.
Intel's calculation here likely is that there is no point in incurring the additional production costs for soldered IHS when it is not necessary to operate the chips at their nominal ratings.