Great read. I thoroughly enjoyed it, and also enjoyed the comments. But alas, I can't sit idly by and not add my own thinking. To provide some context, I've seen the inside of BOTH companies in multiple roles, so I believe I have some insight.
What the article has essentially right? Intel's mfg prowess, FinFet design, aggressive nature in moving mfg down Moore's law. Very real, very powerful, components contributing to their success. Having seen 300mm conversion inside, having seen multiple node transitions, they do it well, and the do it often. This is arguable what kept AMD at bay when they had a superior design for several years.
The FinFet design is novel, and while yet not proven in HVM, will provide is some real shrink in die size and power. Bravo INTC! But, it mostly stops there.
What is has wrong, or simply ignores, changes everything.
Future node challenges to INTC's mfg prowess: NGL (next gen litho, the technology behind those tiny lines and spaces), it exponentially expensive. Current immersion litho, without continued design tricks, it hitting a wall. That leaves EUVL, which still has multiple mfg issues, not to mention herculean cost issues (about $60-80m/tool). Intel will need to shoulder this cost ALONE likely, which will render most of their design advantage mute. A new fab used to be about $1B. They now are approaching $3B. Intel's traditional model was to recoup these costs in the first 2 years of a new tech ramp, on the latest and greatest parts (server parts mostly). This obviously depends on their margins, but doesn't allow for dilution of those margins on much thinner MSoC margin die. They then waterfall lower margin processes/parts on older tech/node fabs. In short if MSoC needs cutting edge mfg, it challengs INTC's traditional model. 450mm savior? The equipment industry still stings from the 300mm conversion, and the loath converting to 450mm. Yeah, INTC will eventually brute force it, but at what cost? The tool makers still will need to recoup their R&D. So each tool simply goes up in cost, and they sell fewer and fewer. It's a brutal treadmill they're on, and it's running out of steam.
QCOM GPU team has left town, so they have nothing. One, I've verified personally that at least one of the key individuals stated to have left, is indeed still employed at QCOM. But yes, key talent leaving hurts. However, unlike sports (the comparative analogy), key talent in tech leave behind IP, previous works of art, even "know-how," which is legally protected, and can be FULLY utilized by their owner. QCOM not only maintains the IP, but they are extremely aggressive in protecting it. SIRU will need to create complete NEW, and novel techniques in order to license new GPU technology. But maybe most important, any future licensee, that may even smell the threat of a lawsuit from QCOM, will avoid SIRU like the plague. QCOM has deep pockets to defend their IP, the will, and past experience (look at Nokia settlement etc.). GPU capability loss is a extremely weak argument in my opinion.
Missed elements to INTC domination proposal. The ARM ecosystem, and massive install base. As mentioned, even MS w/ Windows 7 and 8 is now ARM compatible. The new game banks on licensing, and cross-licensing, none of which INTC readily does. They try to hold onto their IP. QCOM's model is to license wide and far. It simply proliferates the technology, broadens the ecosystem, and generates cash flow. Further, having spent some time in INTC's business development area (after their mfg area), they use the same mentality w/ customers as with thier mfg, brute force. I met so many customers that were loath to use INTC, but had not choice. The computing industry was sucked dry of value (look at Dell and HP), by INTC. In other words, folks don't want another computing industry scenario to take over MSoC and cell phones. Most underestimate that visceral response.
Finally, high level computing will be required for MSoC. I agree w/ other comments, and say no. GPU power for hand gaming etc. yes. But raw computing power, in niches yes, broadly, no. Look at most user models. Do you work spreadsheets, or edit pictures, etc. on your phone, even your iPad? Not really. Most of us still move to a laptop. It just won't be a drive.
Finally, I would argue a completely different component will arise as a critical enabler for the mobile platforms, and it's NOT silicon. It's the display. The display is the key interface for all mobile platforms of the future. So touch interface and SW, and power consumption will be key enablers of future mobile devices. Does that matter? I believe yes. And which of the two is playing in that space? QCOM.
INTC will be competitive, ala AMD like in QCOM's AMR markets. It will be good for the industry, and customers, but they will not dominate. Take that to the bank.