Mobile: Intel Will Overtake Qualcomm In Three Years

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Intel ATOM single core yes, but How many threads? Please when writing about chips, tell the reader
the number of cores and the threads per core, even if the processor has one core and one thread,
say so. The current technology, as it now exists, needs to be fully described it this manner in order
to eliminate confusion.
 
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Seems like people are completely ignoring the fact that Qualcomm includes their modems in their chips that work on all networks, which is a big reason OEMs use them. Single chip solution...not something Intel will be able to provide.
 
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I can look out the window and see the QUALCOMM building next door from where I am right now. they don't look too worried.
 

baron_yole

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Feb 5, 2012
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Thank you for this interesting article. You are taking into account the IC design / IC manufacturing / graphic parameters to analyse the evolution of this battle.

However, you are missing one very important point which is more and more critical nowadays which is IC packaging & 3D integration (by the mean of the capability to partition SoCs in terms of IP, manufacturing node and process)... and in this space, TSMC & Samsung are much ahead of Intel in terms of technology advancement. 3D IC integration by the mean of 2.5D interposer substrates (such as Xilinx Virtex 7.0 FPGA 3D-SOC) or Wide IO memory to logic 3D stacking with TSV will show up as soon as 28nm node generation and will provide additional flexibility versus cost versus performance value than 22nm single dies MSOCs. Maybe Intel can compete to 3DIC chips with single die MSOC on 22nm... but what about the assembly & packaging of such chip? What about the flip-chip laminate substrate price associated to this chip (ask Ibiden, Kinsus, Nanya or unimicron)... you will get to know with further detailed analysis that the packaging & 3DIC partitioning parameters are becoming much more critical starting on 28nm and even more on later nodes (22nm and below) to differentiate your MSOC product value on the market.

And in this space, Samsung and TSMC have much more advance than Intel to date... bringing up the competition older IC manufacturing designs (like gate last, 28-45nm) compared to leading edge 22nm and sub-20nm processes. And as TSMC / Samsung are serving the Apple, TI, Marvell, STEricsson, nVidia and Qualcomm of this world, the battle of 3DICs versus single die SOCs is just at its beginning... will be interesting to follow as Intel will push the 2D-SOC trend to its ultimate limits... while the other player have already anticipated the move to next generation 3DIC/3D-SOC partioning. Again, the wireless IC players will take more risk than either to keep ground in this booming mobile / tablet space... but are likely to be much better prepared for the next two decades of evolution which will leverage this unprecedented flexibility in the design and manufacturing of future high performance, low power, low cost SOC chips. Because it is all about finding the next machine that will drive for at least two more decades what the Moore's law has achieved the past 40 years.

by YOLE Developpement
 
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sorry to say, other benchmarks indicate medfield is not so great. following link indicates it still trails snapdragon in most benchmark, and medfield at 2 ghz while snapdragon s4 at 1.5 ghz.

http://www.engadget.com/2012/09/18/motorolas-razr-i-benchmarks-intel-2ghz-medfield/
 

qdahil

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Apr 12, 2013
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Mark was hallucinating when he posted this article. DjEaZy was correct in his comment. If Qualcomm seats and do nothing then "Mobile: Intel Will Overtake Qualcomm In Three Years" can happen. This article is absurd.
 

ntsan7890

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Sep 20, 2013
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Update for Year 2013
Some Intel inside phones and tablet
Bay Trail outperforms Qualcomm 800, but on tie with Apple A7 on CPU front
on GPU front it is in the middle of the pack using Intel HD graphics (4eu)
 
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