With m.2 the memory is compressed into a small area, which leads to high heat density especially on pcie4.0 m.2 drives. If they could spread the memory out over a larger surface area like in 2.5 inch or 3.5 inch drive, that should be much easier to cool
I wholeheartedly agree with you that I’m interested in seeing what cable they use to power these devices as well as transfer data to/from the pcie bus. They could usb-c similar to thunderbolt, since we know such cables can carry power delivery, pcie, and data. But of course thunderbolt is limited to only 4 lanes of pcie3.0.