News Raja Koduri Flashes 'Petaflops Scale' 4-Tile Xe HP GPU at Hot Chips

[TJ Hooker]

Pretty much. Here's a few of the many they have:

Multi-chip package with offset 3D structure: here.
Multi-RDL structure packages and methods of fabricating the same: here.
Molded die last chip combination: here.
Configuration of Multi-Die Modules With Through-Silicon Vias: here.
Reducing chiplet wakeup latency: here.

I see, thanks. Yeah, those all seem to be specific details regarding particular implementations of MCM. EMIB in general obviously doesn't infringe on any of them given that EMIB is older than any of them. And we currently have no evidence that the particular implementation of EMIB for XE HP infringes on any of them.

So although AMD may have a variety of patents relating to MCM, we don't have any reason to believe they're relevant to anything Intel is doing.