If anyone's still looking up this thread, I'd like to throw in my 2c worth. I've been reballing and reflowing ATi, nVidia, and Intel chips for quite some time now. The nVidia g86 chips are failing at about the same rate as the 7600 chips. While I believe the liquefying underfill -could- cause chips to die, the vast (greater than 90%) majority of failures is STRICTLY BGA! I remove, reball, and reattach the chips, and they work. I think it's the lead-free balls that cause the problems. If the underfill were truly the problem, then wouldn't reflowing the chips have zero effect? If the problem were a defect in nVidia g86 chips, then why are the 7600 chips dying just as fast?