All the hype aside, could Tom's include an actual industrial "Silicone Heat Transfer Compound", such as the one by MG Chemicals :http://www.mgchemicals.com/products/greases-and-lubricants/thermal-greases/silicone-heat-transfer-compound-860/, any of the future comparisons. If this stuff is good to use in mass industrial applications, how can it not be any better then let's say AS5.
Plus, AS5 can short out your mobo if some of it gets on the PCB and it costs 10 times as much as the industrial stuff and I don't think it is 10 times better.
A few things:
1) Have you looked at the technical specifications of that particular paste ? It says, the thermal conductivity is only 0.773-0.657 W/mK, which is about a order of magnitude LESS than tested products (AS5 at 9 W/mK and MX4 at 8.5 W/mK).
2) The compound is only made from zinc oxide and a binder oil. This is no different from the cheap Zalman compounds (the generic white paste).
3) These pastes are meant for low power density applications, I have 2 tubs, and they are piss poor on computers (high power density applications), but just fine for what they are made for - cooling very low powered circuits like voltage regulators (not for computer use, but analog use), opamps, low powered transistors (like for amplifiers). This is the stuff you find inside your stereo, between the transistors/chip amps and the heatsink, where the chip is dissipating about 50 watts of heat maximally (and not prolonged) over a surface area 10 times larger than a CPU-heatsink contact.
4) The AS5 isn't conductive. It doesn't contain un-oxidized silver. It is slightly capacitive, more so than other compounds. But it isn't going to burn out a computer by shorting it, it is not a conductor. That said, I much prefer Ceramique 2 (the original Ceramique was terrible) or MX-4.