Zalman Wants You Designing Its Next Heatsink

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A boomerang shaped tower/duel tower cooler to suck air straight up from the gfx cards and from the bottom front of the case. The point of this design is to reduce the drag from coolers in cases with the side fan + 120mm rear + 2.140mm top fan placements. This design could be fan less when used in the previous case or with duel fans on the front and bottom.

The diagonal section should be raised above the ram with a versatile fan mounting system to allow either
a) installation of ram with tall heat sinks and a 90mm fan only on the heat sink; or
b) Installation of a 120mm fan over ram with no/low heat sinks to promote air flow over system ram.
To the best of my knowledge, this feature would be unique as no case or heat sink design allows for a high flow of air directly over a system's ram without using limited spot fans.

The fin gap should be larger than current tower coolers to reduce both weight and drag, while providing slightly greater cooling surface area than current tower designs.

Disadvantages to this system include complex heat pipe bends and the need for an anti-clockwise fan (should be the fan included for the obvious reason).
 
Do the same concept as a liquid cooling system but instead using the liquid to transfer the heat to the radiotor use heat pipes.
 
As far as a regular heat sink and fan cooler, I would like to see a high performance low profile setup.

For fan-less, I would like to see some natural looking setups inspired by nature or natural formations.

As far as Liquid Cooling goes. It would be cool if they could slap a Radiator/Pump on a PCIe card. I know there would probably be some limitations with weight and such but it would be cool if the setup could be powered through the PCIe slot and then the air could be blown across the radiator out the open slot similar to air blowers that you can get for PCI slots.
 
They need to get some Phy Lessons 1st is (Delta)Q = MC (Delta) T........
Then they its enough copper copper and copper .........they should develop some better alloy with more C and c (Heat Capacity,Specifc Heat Capacity)..........then use it in making a Heat Sink after study of some thermal dynamics.........THATS IT ZALAMAN KEEP GOING...........And Remember The Physics..
 
2 ideas
1) Take a CCF-120 or IFX-14 type coolers and add a water cooling to the middle-top of the fin area, imho this could reduce size and weights by 1/3
2) redesign pipes to angle the ends upward and move the fin block closer to the top of the case (assuming vertical MB) and directing airflow to the upper case fan/port. This would have to keep pipes aligned front to back (makes moving pipe at an upper angle easier).
increase pipe diameter to increase contact surface for fewer pipe or go back to increasing the number of pipes and stack them.
 
Synthetic Diamonds embedded into the copper. That's the future. People at my university are researching it. It will increase the heat transfer coefficient considerably. Otherwise I suppose another option would be customized geometry for specific systems in terms of how long or wide etc-more fins that can be fitted again increases heat transfer coefficient...
 
[citation][nom]theshonen8899[/nom]You underestimate Zalman sir.http://www.zalman.co.kr/ENG/produc [...] sp?idx=116[/citation]
I want this case, but for my modern dual-Xeon motherboard, with at least an 800W EPS12V PSU. That case is absolute perfection, IMO. Now if I could just get one that works for my system. Perhaps the innovation that is needed is a modular design that can be customized to work with a variety of systems.
 
Using two 120mm fans infront of the pc case duct together to a 60mm flexible hose. This would create a 4:1 high pressured funnel. At the end of the hose would be an enclosed large heatsink. At the end of the heat sink would be another higher rpm 120mm fan to pull the incomming air from the front two fans.
 
I'd like to see a low speed barrel fan used. The heat pipes work well but work better when the liquid gravity feeds back down to the hot surface (CPU). Considering that the majority of motherboards are on their side I am surprised that heat sink manufactures have not allowed for this. Glad to draw it up the concept for you.
 
Imagine this, a Harley Davidson branded (made by Zalman) Miniture heatsink in the shape and form of one of their engines. The cooling fan could be on the Radiator of the mini-engine.

The CPU overheat warning could be the sound of the loud rattle of a Harley Engine.
 
Another idea, how about a Zalman branded portable A/C unit, specifically designed to output filtered, cold air into the air intake of the PC Case.

Contact me via PM. I can pitch the idea for you.
 
How about a fish tank concept with 2 chassis. By having a waterproof internal chassis act as a heat pipe and with all the hardware fixing in it and somehow connected to the heat pipe/ internal chassis. The internal chassis then submerge into the outer casing fill with liquid to cool the hardware.
 
Space optimum big passive cooling using aluminium not covering RAM slots nor any devices next to the passive cooling..
 
I would like to see a design similar to that of the condensor units for central air conditioners. A hollow center with say 8-12 heatpipes running up through copper or aluminum fins and a large (120mm) fan drawing air from a cool vent pipe and forcing air out through the fins. Obviously the heatsink itself would have to be sealed in order to create a positive pressure inside the unit to force air through the fins.
 
superconductive aerogel heatsink plus superfluid helium flow.
Pros: ultrastable 2 Kelwin temperature, up to few kW max heatload.
Contras: superconducting aerogels are unknown so far; helium liquifiers eat few rooms of space, installation and operation costs are enormous

no go?

OK, other idea. by using one continous contact interface one averages out the heat power density over whole surface of the chip, and lower therefore the heat transfer efficiency. use instead bundle of isolated micron sized copper wires with active with dense coolant on the other side.
Pros: big temperature gradient chip-wire with almost cold wire -> max efficiency of cooling only in spots where its needed
Contras: liquid coolant needed -> two-level system; microtech level sink manufacturing
 
Heatsink design utilizing fans:
A big tower heatsink with a lot of surface area from the fins. It should have a minimum of 6 heat pipes that travel zig zag from side to side (like left to right) that is similar in fashion to the pipe in a water cooling radiator.

Water Cooling
Self-contained water cooling units are very nice. There is no need to go crazy with the design. For starters, make sure you have a thick 120mm radiator that is easy to install in a push/pull setup. If you want to go thicker, you could stack 2 120mm radiators together. Also, include all the screws for this in the package. Next, design a cpu water block that has a lot of surface area. The pin design seems to work very well. Look at Swiftech's cpu blocks for example. Lastly, but very important is the pump. Make sure your pump is strong. Think of all the space around the cpu and how much you can mount to the motherboard safely. Since air heatsinks are so large and heavy, that should be your thresh hold for your water cooling design. My point is, with all that space you can use a bigger pump. If you look at the popular water cooling parts for cpu cooling, a Swiftech cpu water block and a Swiftech MCP655 pump combined into a small box that mounts to the motherboard is still a lot smaller than the huge tower heatsinks.
 
I have many ideas on this, I am in the hvac industry and hav assisted in the design of many data centers, i build all of my computes and have found that a hybrid cooling tower set up with a modified heat recovery wheel has much potential. One problem with this is price to market....not sure how to make it profitable....
 
I have many ideas on this, I am in the hvac industry and hav assisted in the design of many data centers, i build all of my computes and have found that a hybrid cooling tower set up with a modified heat recovery wheel has much potential. One problem with this is price to market....not sure how to make it profitable....
Click to expand...
I'll get started on Solidworks flow simulation.
Click to expand...

Man... my little free copy of Blender 2.5 and I are completely outgunned here. :??:
Oh well... I tried... got a feeling we're all about to get beat into the dust during the last half of the competition, though, by people with access to some really massive software.
 
some what of the concept that i was getting at but instead of a peltier set up to compensate for condensation....use heat recovery to eliminate it. The cooling tower is for the obvious. It would have to be external though...hard to make mobile.
 
It would be interesting if there was a cooler that was essentially a cylinder with fins and mounting brackets. It would be sort of like one big heat pipe with fins coming out of it and possible a fan on top to keep it cool.

Another idea is a fan similar to some existing Zalman products that directs air out the back of the case but it comes with airflow adjusters on the front so you can make the air travel over your ram before cooling the CPU fan. You may even be able to incorporate some additional flexible heat pipes and heatsinks to put on the RAM.
 
water block with circular radiator and fan attached directly to water cooling block - sealed unit like H50. LED fan and clear in and out tube up into radiator. radiator mounted vertical to MB. elegant nickle plate

old man
 
[citation][nom]domenic[/nom]I'll get started on Solidworks flow simulation[/citation]

SW flow simulations are crap, proved to be not accurate.
Use CoolIT, simulation can take up a few hours, but it utilizes CFD properly.
 
1st, i would want to have the heat pipes go through multiple S-curves in order to have as much surface area contact the fins as possible (possibly even smaller piping to enhance this). A peltier of some type is always a plus at the base in order to facilitate heat transfer to the heatsink. The ability to install fans on either one/both sides and even on top to take advantage of vents hold in the back/side/ top, etc of case (wherever they may be) to ensure good airflow.
Otherwise, if a system would allow for flexible cooling pipes in the design, to be able to move the heat from the core heatsink to the back of the case has always been a favorite of mine. Allowing the heat to dissipate to the back of the case and outside always helps to keep hardcore rigs running cooler. Also, with flex pipes, the possibility of making the system user-changeable would allow to chain video cards, northbridge, etc to get into the loop.
 
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