Best Way to Apply Thermal Paste

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This is probably the most asked question, and I've researched the internet but I cannot find a a solid answer for it. Everyone has their own opinion and opinions are not facts or a valid benchmark.

Does anyone know of a scientific test that was used which proves the best way to apply thermal paste? Did Tom's ever do a review?
 
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We are arguing over how to apply thermal paste, really it makes a fraction of a degree difference. So on the subject of a fraction of a degree difference all those oils, dirt, (probably alot of dust, especially if your using any old parts) and skin cells can make a fraction of a degree difference.
 
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lol this is great

first off don't use your finger your fingers are oily
second off AS-5 is not conductive though it is slightly capacitive

Doesn't really matter how you do it, the goal is to get the thinnest layer you can spread across the entire surface without going over or having any gaps. Personally I use AS-5 and follow the directions that they were kind enough to provide for the product they designed.
http://www.arcticsilver.com/arctic_silver_instructions.htm
 
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actually it is quite correct. seeing as TIM (thermal interface material) is not nearly as heat conductive as the metal of the heat spreader (metal thing on top of the cpu) or the heatsink (thing with a fan you mount on the cpu) you want the thinnest layer possible without any gaps. TIM is an insulator when compared to the metal components it is used to connect, the purpose of TIM is to fill in the minuscule air gaps (air being an extremely efficient insulator) between the two and form a constant layer of contact. If that layer is thicker than necessary you are reducing the thermal conductivity of the union.
 
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Pea methods are the best, use ur finger and u`ll have an air bubble stuck between ur heatsink and your cpu! check it on youtube video on how thermal paste work. The video shows some methods and LIVE of the results!

But then you do not want anything else between a cpu and a heatsink, its only a thermal paste. Then another thing to consider is your own thermal compound, is it premium? or just an average thermal paste. My personal choice is a thermal compound from noctua NH-T1.

Some thermal paste needs time to actually works between the CPU and heatsink, but with NH-T1 from noctua, u dont need this stuff.. it works straightaway when u put ur paste in between. its safer, its more efficient and u can apply it 15 times (0.5 mm/ each install).

 
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Spentshells is right. Unless you have a lapped cpu and heatsink then if the layer is too thin there will be gaps. This is why not spreading it is a better method. If it spreads itself then it will be thicker where there is gaps (and its needed) and thiner where there isnt, providing you use the smallest amount necessary you will get very good coverage from pea/lines method.

 
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qbit and spentshells, thermal paste is intended to fill in microscopic imperfections (and also make sure air doesn't get in those gaps)when the heat spreader of the cpu and HSF were machined...the thinnest layer you and i can possibly get...even with a razor blade would already be more then necessary as it needs to fill in MICROSCOPIC gaps...these small gaps don't look like much but do make a difference in conductivity. Anything more then the "thinnest layer possible" is to much as the thermal paste isn't as conductive as the metals of the HSF and CPU so more then needed Thermal paste would actually cause temperatures to increase. So you are wrong.
 
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Your presuming that the cpu and heatsink are flat. Look at any lapping guide and they will show you just how big bumps can be on the surface of the processor. Your right if its a lapped processor and a lapped heatsink but the stuff out of the factory floor is nowhere near as smooth.
 
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I never said they were flat...if they were flat we wouldn't need thermal paste now would we?...the bumps are tiny, microscopic mostly i said unless the hsf is deformed. Therefore thermal paste needs to extremely thin, the thinnest a normal person can get it with a blade or whatever. This thin layer isn't much but its more then enough to compensate the imperfections.
 
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Your argument is that the bumps are tiny, microscopic even. Im telling you there not, unless you lap your processor. Heatsinks are often much better at having a flat surface but the processors themself you can run your finger along and feel the bumps. For this reason the thinest layer possible isnt always best instead it should be thicker in some places than others (which is why most methods spread by pressure not by finger/creditcard/razor). Although it makes such a small difference either way.
 
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Don't do what i do and use a Q-tip. I'm sure i leave fibers which get incinerated. lol

Eh, who cares. It works and I've got my CPU OC'd 1ghz. Fact is, if you get too much you run the risk of excess oozing out onto your motherboard when the heatsink is applied. If you get too little, your not maximizing the thermal transfer aided by the paste. I think if you're really trying to OC the max out of your CPU, use the business card method and make sure it's covered.

Then again... i did get 1ghz out of my CPU by using a Q-tip. So how much does it really matter? lol
 
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