Ahh. It's a Ryzen, not an intel. Definite differences there.
First, Intel at idle drops clocks and voltages equally on all cores. Any background tasks get split up over all the cores, so any service startups show minimal temp changes, the hottest core barely higher than the rest of the cpu.
Ryzen does the opposite. It puts all cores as inactive except 1 core, and it rotates that single core every few seconds. That single core has the full load of every service and startup, so shows a marked raise in temps. That's the Ryzen Bounce. You'll get jumps of 10-20°, but since temp recorders only show hottest you get idle temps of 40-60°, but it's a single core only, not the entire cpu.
Secondly, Intel use a monolithic die. A single rectangular silicon chiplet dead smack central under the IHS. A pea sized blob is perfect to spread around and cover the entire die easily.
Ryzen like the 3900x use 3 chiplets, 1 on left and 2 on right. This puts the memory controller/Lcache and cores a distance from each other, for heat management, they communicate via Infinity Fabric. As such, the chips are all the way up against the edges and corners under the IHS, so pea sized blob very often doesn't cover everything. This leads to runaway temps and shutdowns. The best way to paste a Ryzen is to credit card or spatula spread the blob beforehand, making sure the entire surface of the IHS is covered in a thin, even layer. This guarantees the cores are covered to the edges and corners.
3900x is same as left picture. Drawing a circle, you'll see how corners get missed easily on the double chip side, which is the cores.