IC Diamond Test Results

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13C !?!?! Damn, that's below ambient (22C). Where do you live !?!?!?
 


Thanks for taking the time to test, always appreciated.


What was the before compound?

 



I break out all the compounds individually when we do the final test results.

But as you note from the test results if you are looking for performance I think you can draw the conclusion just about any performance grade compound will beat the stock hands down - some do have good reliability features not found on the performance side
 
Hm.. that's odd.... the HWmonitor says my CPU is a E2220... but it's a E2200.... there's a difference between the two... :heink:

Coffee

PS: FYI, I have reached idle temps of below 8C... Muhahahahah my secrets shall never be revealed XD
 



Psh.. try hitting below 8C with air cooling. Anyone can pull that low with liquid nitrogen =P
 


Sorry I cannot remember what compound I had put in last. It was a while ago.
 


Nah... that's way over kill..... lol
That's something you'd use for a super computer xD
 


Rhetorical question! :kaola: Why do you build PCs? why do people play games? why do we watch movies???
Everyone has a different hobby, mine is a bit odd as I like to one day hit 1C w/ air cooling :na:

Coffee
 




air cooling includes dipping only the heatsink in a bucket of ice..........or putting your computer in the freezer



..................or using some sort of coffee =P
 


Coffee?

Coffee?

Please leaberate how you sue Coffee to hit 8C on air.
 
I saw all these great results so I bought my own IC Diamond 24 tube, I was looking forward to and expecting the same results, unfortunately I did not get what I was hoping for.

I followed the application instructions from the website exactly as they had laid them out and suggested it be applied, all the settings were the same only the TIM was changed.

Here are the CPU results at 23c ambient controlled room temperature;

Q9550 @ 2.83 w Xigmatek S-1283 Cooler on Video surveillance computer running 24/7

Artic Silver 5 seated

Desktop Idle = 38,40,40,38 Avg = 39c
Load 3DM06 = 50,48,51,45 Avg = 48.5c
Load Prime95 = 52,52,53,51 Avg = 52c

IC Diamond 24 running 87hrs seated

Desktop Idle = 38,38,40,40 Avg = 39c
Load 3DM06 = 51,46,49,52 Avg = 49.5c
Load Prime95 = 54,52,53,54 Avg = 53.25c


I also applied ICD24 on my main gaming machine but was noticing higher temps than I had previously seen, I do not have the AS5 before temps for this machine as the cooling fans for this machines heat sink had been changed out for higher CFM fans, with the ICD24 application, however I knew what cooling performance I was getting before, so I removed the ICD24 and went back to AS5.

AMD 965BE @ 4G w Cooler Master 212+

IC Diamond 24 running 88hrs seated

Desktop Idle = 31c
Load 3DM06 = 48c
Load Prime 95 = 52c

Artic Silver 5 fresh application not cured or seated, will improve when fully cured and seated.

Desktop Idle = 29c
Load 3DM06 = 47c
Load Prime 95 = 52c

IMO, I wasted my money on ICD24, but we all live and learn!

Now this is my personal opinion of ICD24, after it has cured in place on the CPUs heat spreader, it is very difficult to get off and there is no doubt what so ever it contains diamond dust, if you were to change out multiple times you'd probably end up with a lapped heat spreader.

So be careful removing the seated compound, as you'll also scratch the heat sink base.

4ryan6

 


Troubleshooting Note

While most see an improvement out of the gate (80%) approx. 20% do not.

We performed some some contact and pressure tests
on 5 different forums

To get a sense what the test data shows follow the link

80% of the 20% that did not show improved performance had either light pressure and/or poor contact so we can account for 95% of peoples results however the remaining 5% we have no explanation for. Light pressure and/or poor contact tends to homogenize results between pastes. All compounds improve with more pressure, ICD a bit more.



Generally the way compounds work

Good contact will give a good result

High pressure will give a good result

Good contact and good pressure is best - the Simple Unified Theory of Paste Performance.

Commonsense as these are the most recommended solutions as answers to thermal problems posted on the forums


PreliminaryMultiForumTestResults146.png

 


Thanks for the feedback, Looking for actual wear reports and not seeing any I would like to reiterate our point on abrasives



In 3 years in the field I have had no complaint on the abrasive issue with the exception of a couple of reviewers who were doing multiple installs.

Those people that lap and understand abrasive grades will get what I am saying very quickly.

if you take a piece of copper and lap it to a < 3 micron finish then with a 1 micron polishing compound now you have a true mirror finish.

Now if I take a soft abrasive like toothpaste and rub it in it will scuff the surface and ruin the true mirror finish.

If I substitute a number of thermal compounds and rub the finish for a few seconds they will also destroy the mirror

Many thermal compounds contain larger grit sizes say something like 15 to 30 microns in size and are composed of aluminum oxides, ceramics and other hard particles - in other words many thermal compounds are made with the same materials used for metal and other polishing, they are by default lapping compounds.


You will get wear and tear as a consequence of multiple installs and removals, cleaning etc. and as such some care should be taken to minimize damage when the lettering is only a couple microns deep. Abrasives have to move in order to work. The less wiping, rubbing, sink rotating under pressure or multiple installing you do the better. When removing let the solvents/liquids do the work.

Take a flat sheet of copper that is slightly oxidized - with a clean cloth try rubbing with AS5,MX2,Arctic alumina,OCZ,TX3 etc.

They all polish in a few seconds with a little elbow grease.

It's safe to use on exposed dies -Just do not over work it, IC Diamond or any other compound, Just good commonsense shop practice


vhardness.jpg



 
@IC Diamond

If I was going to apply any reasoning to the difference, it would be my Artic Silver 5 application method, as I've been using AS5 for about 5 yrs or so, my application method has changed over the years to the point, I know exactly how to apply AS5 for maximum results.

All compounds improve with more pressure, ICD a bit more.
Click to expand...

So my heat sink clamping pressure is inadequate on both my computers?, as far as clamping pressure is concerned when I removed the heat sink the footprint, looked spread out so I don't see that was a problem.

What do you recommend for removing the compound to avoid scratching the heat spreader or heat sink base?

You didn't comment on that.

Commonsense as these are the most recommended solutions as answers to thermal problems posted on the forums
Click to expand...

:non: Common Sense, that must be it, I'll have to see if I can find some of that.



 



Well the reviewers that were doing multiple installs were complaints, in your 3 yrs in the field, where you say you "have had no complaint", and I believe I said "change out multiple times."

Now this is my personal opinion of ICD24, after it has cured in place on the CPUs heat spreader, it is very difficult to get off and there is no doubt what so ever it contains diamond dust, if you were to change out multiple times you'd probably end up with a lapped heat spreader.
Click to expand...
 
I do not doubt your results you got what you got - what's to argue?

Well the reviewers that were doing multiple installs were complaints, in your 3 yrs in the field, where you say you "have had no complaint", and I believe I said "change out multiple times."
Click to expand...

Sorry! this was a cut and paste and a general response - I hate retyping same thing on multiple forums and should have made that clearer.

So my heat sink clamping pressure is inadequate on both my computers
?, as far as clamping pressure is concerned when I removed the heat sink the footprint, looked spread out so I don't see that was a problem.

What do you recommend for removing the compound to avoid scratching the heat spreader or heat sink base?

You didn't comment on that.
Click to expand...

I do not know what your heat sink pressure is or your quality of contact I haven't a clue.

When a user does not get an expected result as a function of support based on our experience and accumulated knowledge we try to provide trouble shooting ideas and would be remiss especially if somebody paid for it and had a problem. You may be part of the 5% that have good pressure and contact and fail to see a result, it happens but we can account for the other 95% which is more than any other paste manufacturer has done.

It is hard to trouble shoot problems from a distance and can only offer most likely scenarios from other users experience.

Cleaning - Use a little Acetone to soften/dilute compound then wipe off - then use Isopropyl alcohol as a final cleaner as it leaves almost no residue
When used as a thermal compound should be used I see no difference in daily use from any other compounds and I do it almost daily.

The "Scratch issue" to me seems overblown more forum Buzz talk than anything. I am at around 500 user tests on the giveaway's at this point in the giveaway's and not one complaint of scratching. You yourself admit to no scratching or even polishing

As a point of definition there are no particle sizes in ICD large enough to leave a "scratch" The grit sizes are of a polish grade so if you had a high power microscope you would observe micro scratches otherwise it just gets shiny to the naked eye




 
The "Scratch issue" to me seems overblown more forum Buzz talk than anything. I am at around 500 user tests on the giveaway's at this point in the giveaway's and not one complaint of scratching. You yourself admit to no scratching or even polishing
Click to expand...

I didn't admit to no scratching, that's not true!


Try to at least remember I'm not a user test giveaway, I'm a customer, or at least I was, I'm through with this conversation! Goodbye!
 
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