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[Eximo]

I think it depends on the cooler and how overzealous some people are with mounting pressure.

I use a waterblock, which I assume adds quite a bit of stiffness to the socket.

 

[Amdlova]

@bit_user Intel are nuts some one need to make a deep dive on the cpu stepping c0 b0 h0 some models has same name but are different revisions.
Make a small difference of 10%. All T cpus I have tested none can run my kit of 4x8gb 4000mhz. On 14600T work right of the box.
Raptor lake refresh has better IMC or this thing is another kind of chip.

 

[thestryker]

If there is no cooling benefit then what's the point and where is the issue? I've been using my system without one from Nov 2021, still nothing to report.

There's a lot that can potentially happen over time from damage to the board to lowered stability. You didn't notice any differences, congratulations, but that doesn't make this a good design. High speed memory stability was one of the early benefits of using a contact frame. The type of cooler as you noted can also make a difference in whether you have temperature benefits.

The best standard retention mechanism Intel has ever made is the one from LGA2011/2066, but it costs something like a dollar or two more to use. So in the end there's a poor retention mechanism for no other reason than Intel could save OEMs money (AMD is just as guilty here, but they don't have as long of a shape nor as much mounting pressure).

 

[bit_user]

@bit_user Intel are nuts some one need to make a deep dive on the cpu stepping c0 b0 h0 some models has same name but are different revisions.
Make a small difference of 10%.

Please clarify: do you mean different revisions within each die stepping? How can one determine the revision, or are you just talking about what generation it's branded as?

All T cpus I have tested none can run my kit of 4x8gb 4000mhz. On 14600T work right of the box.
Raptor lake refresh has better IMC or this thing is another kind of chip.

That could be a difference in the microcode. They know the silicon quality improved, between the earliest Gen 13 and the first Gen 14 silicon. This gives the Gen 14 chips potential to run with better timings and perhaps other tweaks. That's my theory, at least.

 

[bit_user]

The best standard retention mechanism Intel has ever made is the one from LGA2011/2066, but it costs something like a dollar or two more to use. So in the end there's a poor retention mechanism for no other reason than Intel could save OEMs money (AMD is just as guilty here, but they don't have as long of a shape nor as much mounting pressure).

That's funny to hear, because I had an old LGA 2011 system where I replaced part of my heatsink's mounting system with some nuts and bolts. I probably overtorqued the nuts, but I was always afraid to mess with it, because it just kept working and temps were fine.

I forget the exact reason I made the substitution, but I think it was because the motherboard had its own backplate attached to it and the CPU cooler also provided one.

 

[thestryker]

I forget the exact reason I made the substitution, but I think it was because the motherboard had its own backplate attached to it and the CPU cooler also provided one.

Backplate is part of the LGA2011 spec so every cooler for them basically just used nuts and bolts for mounting.