JamesSneed
Judicious
computerguy72 :
To JamesSneed:
We do indeed have the process information:
Intel 10nm process is: CPP 54, M2 Pitch 44, density MTx/mm = 106.1
GF 7nm process is: CPP 56, M2 Pitch 40, density MTx/mm = 98.21
TSMC 7nm process is: CPP 57, M2 PItch 40, density MTx/mm = 96.49
We do indeed have the process information:
Intel 10nm process is: CPP 54, M2 Pitch 44, density MTx/mm = 106.1
GF 7nm process is: CPP 56, M2 Pitch 40, density MTx/mm = 98.21
TSMC 7nm process is: CPP 57, M2 PItch 40, density MTx/mm = 96.49
Yeah but here is the thing this is in theory since no high speed CPU's have been made on these processes to date. The high power CPU designs always give up some density for better leakage, active power, and performance. Sure if we are talking making SRAM I might agree since theory/white paper specs usually work out but that is not the case on high speed CPU's. For example Gloflo/IBM's design was going for high power chips from the get go so it may already be closer to the density they will use say versus Intel(fabricated nobody really knows). Just saying we should take a wait and see approach before saying one is more dense or better than the other until the we see actual chips because these specs you posted will not be what is used to make any Core i5 / i7's or Ryzen 5 / 7's as all of the foundries use different densities for SRAM and CPU's.