I built a 5700x system last summer. (july)
The motherboard (MSI X570S edge max wifi) had an issue with the 1st m.2 cover. (pics show issue)
Never RMA'd it as I needed PC running (and rma's can take awhile) and everything "works" just "not ideal to have a part not doing its job)
So issue is the m.2 slot cover's standoff came out of the MB's hole.
So is hot glue safe to use on MB's PCB ( on the back as dont want risk the chips near standoff being damaged removing glue) to see if it can hold the standoff in place just to hopefully give it some sort of pressure on the m.2 for betetr thermal transfer?
Any other options that are safe?
I may RMA it in future (before its warranty is over) when I can afford system to be down for process so I don't want to damage it any.
The motherboard (MSI X570S edge max wifi) had an issue with the 1st m.2 cover. (pics show issue)
Never RMA'd it as I needed PC running (and rma's can take awhile) and everything "works" just "not ideal to have a part not doing its job)
So issue is the m.2 slot cover's standoff came out of the MB's hole.
as you can see the standoff hole is missing the standoff
which is attached to the m.2 cover/heatsink (it does not want to unscrew assume it was tightened too much at factory)
and trying to put it back it fits, but nothing to keep it down (it just flops back up which means pressure on m.2 is lacking)
pressing it into its hole to apply pressure to m.2/thermal pad removes gap at pcb...
but only until I release and it pops back up again (as nothing to hold it down)
So is hot glue safe to use on MB's PCB ( on the back as dont want risk the chips near standoff being damaged removing glue) to see if it can hold the standoff in place just to hopefully give it some sort of pressure on the m.2 for betetr thermal transfer?
Any other options that are safe?
I may RMA it in future (before its warranty is over) when I can afford system to be down for process so I don't want to damage it any.