Results differ when lapping. There are even people that have 0C difference between lapped and unlapped. This happens when the CPU is concave and the HS is convex... meaning that they meat together quite well. I'd say this isn't too common though, as almost everyone sees some improvement after a lapping.Obviously this manufacturer does not make quality products! I do not see why we have to work so hard to get it to work after paying good money for it!?
I'd rather buy something ready to go.
However, they were clearly making ASSUMED statements, not educated assurtions. But yes, pure copper does have a higher CP (0.385 J/(g•K)) and thermal conductivity (401 W/(m•K)) than brass (0.380 & 109, respectively), as an example. But to say any pure metal has a high thermal conductivity than any other alloy is just plain wrong. Correct me if I'm wrong, but aren't certain alloys better conductors of heat and electricity because of the better latice structure than their pure forms (in the same way that pure steel is weaker than say, Inconel)? Thank you for the correction and I will try not to flame in the future. Please share some of your knowledge on the subject for us all to be more enlightened.Chemical engineers typically have less of a chemistry background than chemists. You do however have more thermodynamics background than chemists so I will give you that.
Perhaps you forgot but alloys are still composed of individual metals. An alloy can be composed of impure metals inhibiting the heat conduction. So metal purity is a big factor regardless if it is 100% Copper or 50/50-copper /whatever alloy. So in all regards, that statement is indeed true.
Furthermore, being such a big bad BS engineering scientist and all, you should know by now that you can't refute a statement nor make a claim without including supporting evidence...sort of like this one; Your reply further supports my experience that most chemicals engineers are cocky and think they are smarter than everyone else however in actuality are not. So the point is don't flame for no reason...especially if you have ZERO knowledge on how to construct an argument.
Sincerely,
Your local M.S. Chemist
I totally agree with you about Nickel's "insulating" (relative) property. Yes, you are correct about your first assursion, the total heat flux can only be as great as the least conductive substance/interface in the system. My personal opinion (and I do not work in the thermal solutions industry, so I would have no way of verifying it personally), is that the nickel is there to keep the metal from oxidizing BEFORE being put into use. In the same way Intel and AMD package silica (to absorb water) with the heatsinks that come with the processors. The vendors of thermal solutions have no control over the storage condition after it leaves there shipping docks, and therefore cover their butts by coating the entire heatsink in a very stable metal.My entire purpose in posting on this thread, and I think that you will agree with me, is that it seems odd that there would be a layer of Nickel between the CPU and the Copper/Aluminum sink seeing that nickel has a lower thermal conductivity than Copper and Aluminum. You should be better with thermodynamics than I am so I am seriously asking this. Wouldn't the Nickel technically limit the flux of heat away from the CPU? Heat can't be transferred at any higher rate than what the Nickel would allow and Copper would do so at a faster rate. So in an extreme case, it would be like putting a rubber insulator between your CPU and Copper heatsink and expect the heat transfer to remain the same as if you had direct contact with the Copper