ElMojoMikeo :
Only Intel can sort out that problem. The way I see it the lid is the line between third party and Intel.
Yes. That point was made clear in the article (did you read it?) - that even the best coolers are constrained by the conductivity of the material between the die and heat spreader.
ElMojoMikeo :
But this is such new territory what do you do in Intel's position.
The only thing remotely new about it is the amount of heat emitted per mm^2 of die area. But not really, as I think this thing is made on the same process they've been using since Broadwell (including Broadwell-EP).
Intel has used solder before, and others have made chips dissipating even more heat. For one: GPUs Secondly, as I pointed out & aldaia clarified, IBM has dissipated up to a whopping 1.8 kW from a single package:
http://www.tomshardware.com/forum/id-3445596/intel-core-7900x-review-meet-skylake/page-3.html#19850379
So, as Nerd and I were saying, the best option would be to build a vapor chamber inside the package.
http://www.tomshardware.com/forum/id-3464475/skylake-mess-explored-thermal-paste-runaway-power/page-2.html#19924391
Perhaps you could use lithography to fashion capillaries right into the upper surface of the die!
But Crashman has a valid point: Intel is saying their thermal solution is good for 140 W. They're not promising anything beyond that. Maybe such a stance is good enough for their commercial customers, but the mistake they made is that they're selling this as an enthusiasts' part, with a premium price tag. That market expects to be able to push things a bit further.
So, do we know if the new "Precious Metals" Xeons use solder under the IHS?