Only Intel can sort out that problem. The way I see it the lid is the line between third party and Intel.
Yes. That point was made clear in the article (did you read it?) - that even the best coolers are constrained by the conductivity of the material between the die and heat spreader.
But this is such new territory what do you do in Intel's position.
The only thing remotely new about it is the amount of heat emitted per mm^2 of die area. But not really, as I think this thing is made on the same process they've been using since Broadwell (including Broadwell-EP).
Intel has used solder before, and others have made chips dissipating even more heat. For one: GPUs Secondly, as I pointed out & aldaia clarified, IBM has dissipated up to a whopping 1.8 kW from a single package:
So, as Nerd and I were saying, the best option would be to build a vapor chamber inside the package.
Perhaps you could use lithography to fashion capillaries right into the upper surface of the die!
But Crashman has a valid point: Intel is saying their thermal solution is good for 140 W. They're not promising anything beyond that. Maybe such a stance is good enough for their commercial customers, but the mistake they made is that they're selling this as an enthusiasts' part, with a premium price tag. That market expects to be able to push things a bit further.
So, do we know if the new "Precious Metals" Xeons use solder under the IHS?