Well, ok. Do what works for you.
I mean, it's not like I didn't personally test different paste applications myself to sate my own curiousity... how hard is that?
I could just go and take some popular(?) individual's... opinion(?) - IDK what to call it - as fact and not bother, right?
It's also not like he isn't getting paid and showered with swag from most those companies as well, and might not have a vested interest in helping them sell product, and therefore might not have a good reason for telling YOU to waste a tube of paste on each mount job.
Having said that, I just followed the ASUS USA YouTube videos and used a small dot in the centre of the CPU when I did my current CPU - the U12S pushed the paste across almost all of the IHS' surface anyway...
And this, is the WHOLE point from any of us who not only think that this product is a gimmick, but also that using more than the least amount required to get around 80% heat spreader coverage and fill the pores is simply a waste. The thermal paste, TIM, pads, whatever product you want to use or whatever you want to call it, is NOT there to cool, or to magically facilitate heat transfer because it's a better transport, or any of half a dozen other reasons I've heard for why we use paste in the first place through the years.
There is only ONE reason why a thermal interface material is used and that is to bridge the gap between two metal surfaces as much as possible by filling in the microscopic porosity of the surfaces so that there is no air gap. Air gaps, bubbles or blisters are bad for heat transfer. But having a thicker layer of TIM is bad for heat transfer as well. As we well know, if you had two perfectly flat surfaces and there was zero porosity, there would be absolutely no need whatsoever for any thermal interface material at all, but we really can't provide that kind of finish so for whatever amount of peak to valley roughness or porosity you have, based on machining or natural characteristic of the materials, we need to ONLY provide enough TIM to fill those microscopic valleys and holes.
A product like this one, is not just gimmicky, it's gimmicky and wasteful, and potentially problematic for over application.
Yes, Noctua pre-applies TIM on it's enterprise and industrial coolers, and in a similar fashion, but they use what is almost certainly a much better product to begin with AND, more importantly, if you take a very CLOSE look at the application of that TIM you will see that it is a strictly controlled, very thin application. Nothing like the octagonal "cakes" of TIM I'm seeing in the marketing slides for this product. Somebody should go kick the Thermalfake product manager and marketing team, hell, even the CEO, right in the worst spot.