In any case there is nothing wrong with the hardware or the cooling, it was a simple case of Microsoft using a low melting point mix of solder it was lead free. so it melts at a much lower heat threshold. the problem is then because different components expand and contract at diferent rates you get a warping of the mother board so it flexes. Most RROD errors are the cause of the lead free solder on the surface mount of the board melting, then the board flexing back under cooling pulling the Gpu, or Cpu off the board. If they are clever enough with the next Xbox they should fit sockets for the chips, and use better quality solder than being cheap asses.
Oh wait it would be classed as a Pc, no hang on technically it is a a pc.