AMD talks ACP vs TDP again
Powering on
By Sylvie Barak
Wed Feb 04 2009
AT THE INQ we have recently discovered the joys of Twitter, especially when it leads us to interesting snippets we can really tear into. Case in point, a post twittered by AMD's Senior Veep and CMO, Nigel Dessau, concerning ACP vs TDP power measurements.
It is not the first time AMD has tried to convince the world its ACP measurement (or 'fake-a-watt' as we here at the INQ fondly call it) is the way to go, but after reading Nigel's blog, we decided the discussion needed some INQput.
Dessau is right when he starts off by saying tools should reflect real-world conditions, but we tend to disagree when he continues that ACP (Average CPU Power) is the real test of these conditions.
In many ways, ACP is an arbitrary definition conjured up by AMD which no other player within the industry has accepted. Instead, the big industry players like Intel, Sun, HP and IBM have settled on the suite of SPECpower benchmarks run by a committee of industry players hailing from all those firms and even AMD. This, for the most part, promotes TDP (Thermal Design Power), a measurement Intel favours and which AMD considers inherently biased.
But before we get into things, it's important to point out there is a difference between Intel's and AMD's version of the benchmarketing tool.
AMD TDP shows the worst case power draw a particular chip can experience when it's operating at max voltage.
A chip can easily draw a lot of power, but usually only for very short periods of times (like several microseconds). If enough power isn't provided, bits and bobs get lost along the way and calculation errors start cropping up, which is really bad news. So, one would need to be able to supply that much power to the CPU at any given moment, even though CPUs can't draw max current for extended periods – even, say , 1/1000th of a second – making it all very difficult. Over 1/1000th of a second, the CPU could draw between 75-150 watts, but average power usage might be 110W.
When a firm is designing heat sinks, it only really cares about those longer periods of time, while people interested in the actual power, really care about every microsecond.
Intel has a spec for the maximum power of a CPU, it also has TDP, for its heat sink/cooling guys to worry about and adds a thermal diode to shut down the CPU if it starts overheating.
AMD, which only recently began using thermal diodes, has had to be more conservative in designing heat sinks, because the chip could actually overheat. Thus, the firm has had to keep its TDP more conservative than Intel's, hence the reason AMD would rather not talk about it and use a different metric.
AMD uses a blend of different workloads to get ACP, whereas what anybody really cares about is average power draw on the workload and peak power draw/cooling needs. ACP is just an average. It depends on process technology, the temperature the CPU is operating at, ambient temperature and more, making it mighty difficult for someone outside of AMD to calculate.