Hello TomsHardware Fans
Longtime "reader" first time "chatting" I'm building a Clevo P870TM (a.k.a Sager NP9877, Eurocom SkyX9C) laptop with an i9-9900k Intel CPU.
The CPU Memory specs are as follow:
Max Memory Size (dependent on memory type) 128 GB
Memory Types DDR4-2666
Max # of Memory Channels 2
Max Memory Bandwidth 41.6 GB/s
ECC Memory Supported No
Laptop Service manual states the following:
Four 260 Pin SO-DIMM Sockets Supporting DDR4 2666MHz Memory (The real memory operating frequency depends on the FSB of the processor.)
Memory Expandable from 8GB (minimum) up to 128GB (maximum) with i9 CPUs. Compatible with 4GB, 8GB, 16GB & 32GB Modules. Supports XMP 2666/3000 MHz. XMP is processor dependent and works with four DIMMs in dual channel or two DIMMs in single channel.
The computer has four memory sockets for 260 pin Small Outline Dual In-line (SO-DIMM) DDR 4 type memory modules. The total memory size is automatically detected by the POST routine once you turn on your computer. Note that four SO-DIMMs are only supported by Quad-Core (and greater) CPUs; Dual-Core CPUs support two SO-DIMMs maximum. Two primary memory sockets are located under component bay cover (the bottom case cover), and two secondary memory sockets are located under the keyboard (not user upgradable). If you are installing only two RAM modules then they should be installed in the primary memory sockets under the component bay cover. Note that the RAM located under the keyboard is not user upgradable.
I have no idea why the manual states "not user upgradable." The only thing I can think of is if the memory modules under the keyboard were soldered in place. Then they are not user upgradable. The CPU I have is an eight (8) core CPU, which means it supports four (4) SO-DIMMS in Dual Channel or two (2) SO-DIMMS in Single Channel.
16GB mem specs: Capacity: 16GB Memory Type: DDR4 ECC: Non-ECC DIMM Type: SODIMM Rank: 2Rx8 Speed: 2666 Voltage: 1.2V Density: 8G Depth: 2G Pins: 260 pin
Width Height: x64/LP Width: x64 Die Generation: 4th Package Type: Flipchip Die Package: SDP Organization: x8 CL: 19 TRCD: 19 TRP: 19
32GB mem specs: Capacity: 32GB Memory Type: DDR4 ECC: Non-ECC DIMM Type: SODIMM Rank: 2Rx8 Speed: 2666 Voltage: 1.2V Density: 16G Depth: 4G Pins: 260 pin
Width Height: x64/LP Width: x64 Die Generation: 2nd Package Type: Flipchip Die Package: SDP Organization: x8 CL: 19 TRCD: 19 TRP: 19
The obvious differences between the two type of memory are the specs on density, depth and die generation.
2x32GB memory sticks cost $168 as opposed to 4x16GB for $192.
What are the PROS and CONS of 64GB in the Primary Single Channel (2 memory sticks) as opposed to 64GB in Dual Channel configuration (4 memory sticks)?
Longtime "reader" first time "chatting" I'm building a Clevo P870TM (a.k.a Sager NP9877, Eurocom SkyX9C) laptop with an i9-9900k Intel CPU.
The CPU Memory specs are as follow:
Max Memory Size (dependent on memory type) 128 GB
Memory Types DDR4-2666
Max # of Memory Channels 2
Max Memory Bandwidth 41.6 GB/s
ECC Memory Supported No
Laptop Service manual states the following:
Four 260 Pin SO-DIMM Sockets Supporting DDR4 2666MHz Memory (The real memory operating frequency depends on the FSB of the processor.)
Memory Expandable from 8GB (minimum) up to 128GB (maximum) with i9 CPUs. Compatible with 4GB, 8GB, 16GB & 32GB Modules. Supports XMP 2666/3000 MHz. XMP is processor dependent and works with four DIMMs in dual channel or two DIMMs in single channel.
The computer has four memory sockets for 260 pin Small Outline Dual In-line (SO-DIMM) DDR 4 type memory modules. The total memory size is automatically detected by the POST routine once you turn on your computer. Note that four SO-DIMMs are only supported by Quad-Core (and greater) CPUs; Dual-Core CPUs support two SO-DIMMs maximum. Two primary memory sockets are located under component bay cover (the bottom case cover), and two secondary memory sockets are located under the keyboard (not user upgradable). If you are installing only two RAM modules then they should be installed in the primary memory sockets under the component bay cover. Note that the RAM located under the keyboard is not user upgradable.
I have no idea why the manual states "not user upgradable." The only thing I can think of is if the memory modules under the keyboard were soldered in place. Then they are not user upgradable. The CPU I have is an eight (8) core CPU, which means it supports four (4) SO-DIMMS in Dual Channel or two (2) SO-DIMMS in Single Channel.
16GB mem specs: Capacity: 16GB Memory Type: DDR4 ECC: Non-ECC DIMM Type: SODIMM Rank: 2Rx8 Speed: 2666 Voltage: 1.2V Density: 8G Depth: 2G Pins: 260 pin
Width Height: x64/LP Width: x64 Die Generation: 4th Package Type: Flipchip Die Package: SDP Organization: x8 CL: 19 TRCD: 19 TRP: 19
32GB mem specs: Capacity: 32GB Memory Type: DDR4 ECC: Non-ECC DIMM Type: SODIMM Rank: 2Rx8 Speed: 2666 Voltage: 1.2V Density: 16G Depth: 4G Pins: 260 pin
Width Height: x64/LP Width: x64 Die Generation: 2nd Package Type: Flipchip Die Package: SDP Organization: x8 CL: 19 TRCD: 19 TRP: 19
The obvious differences between the two type of memory are the specs on density, depth and die generation.
2x32GB memory sticks cost $168 as opposed to 4x16GB for $192.
What are the PROS and CONS of 64GB in the Primary Single Channel (2 memory sticks) as opposed to 64GB in Dual Channel configuration (4 memory sticks)?
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