paulbatzing
Reputable
@U6b36ef
Unfortunately, the real world is not as simple as you think. With each die-shrink the angle you have to be able to distinguish gets smaller in the optical parts of the lithographic process. That is fine on a small chip, because you can make the lense basically narrower, but if you want to make a bigger chip, the lens has to have a very good resolution (had to be of much better quality) at the outer edges, and that technology is part of the reason die-shrinks take time. In addition, the new finfets will include more quantum effects such as current leakage, which increases the chances of producing faulty parts because the transistors are more sensitive to the thinness of the transistor walls.
All silicon production has a certain failing percentage of transistors, and a new shrink is always more error prone then the previous one. If that wasn't the case, there would be no such thing as chip binning into 1080s and 1070s, and no silicon lottery...
Unfortunately, the real world is not as simple as you think. With each die-shrink the angle you have to be able to distinguish gets smaller in the optical parts of the lithographic process. That is fine on a small chip, because you can make the lense basically narrower, but if you want to make a bigger chip, the lens has to have a very good resolution (had to be of much better quality) at the outer edges, and that technology is part of the reason die-shrinks take time. In addition, the new finfets will include more quantum effects such as current leakage, which increases the chances of producing faulty parts because the transistors are more sensitive to the thinness of the transistor walls.
All silicon production has a certain failing percentage of transistors, and a new shrink is always more error prone then the previous one. If that wasn't the case, there would be no such thing as chip binning into 1080s and 1070s, and no silicon lottery...