Reynod
Administrator
hixbot :
Frankly, this experiment is not rigorous enough to prove to me the TIM is not (partly) to blame.
I think Intel could have made overclocking much cooler with solder.
I think they realized their new chips were "cool enough" at stock with TIM. They realized that stellar overclocking on air improvements would make SNB-E a rather silly choice for many enthusiasts, and they want to save some frequency increase for Haswell.
They have a lead on AMD right now, it's time to limit improvement and save some for later.
All in the business plan, my friends.
I think Intel could have made overclocking much cooler with solder.
I think they realized their new chips were "cool enough" at stock with TIM. They realized that stellar overclocking on air improvements would make SNB-E a rather silly choice for many enthusiasts, and they want to save some frequency increase for Haswell.
They have a lead on AMD right now, it's time to limit improvement and save some for later.
All in the business plan, my friends.
I disagree ... politely of course.

I think IVB was specifically optimised for the mobile space ... hence the thermal ramping problem with overclocking is inherent when the device is really designed to operate slower at a lower voltage and be a real power miser.
Its about 4% faster than SBE and falls short overclocking compared to SB and SBE ... work out the math any way you like but for serviously stable overclocking on water or superior air it won't match up thermally.
However in the moble space I believe it will achieve some wonderous results once all of those additional low power circuitry is brought to bear.
Its a leap forward in terms of environmental sustainability ... thats not something to fob off either.
Its clever how they avoided damaging their own market and moving forward on the mobile space.