This is the first time I see the diagram and I have a very plausible, yet hard to prove, theory with that way of wiring it. If I'm right, the engineers that approved that "daisy chain" of power need to be executed via electrocution.
So, when you solder or even just pressure-attach cables, there's always potential for expanding and contracting the solder, which can cause micro-fractures and micro-pockets of air/dust creating resistance. If you have DC going up and down, then it means you'll be thermally cycling the weakest link in that stupid daisy chain.
So, in short the key aspects are:
- solder quality or attach pressure
- temp deltas (via power deltas)
- time of the deltas (ramp up / down vs temps)
- micro-fractures
I've seen this at a higher level via material fracture for big mining operations (don't ask how I know xD) and when they crack, it's super visible and dangerous, yet they can still operate to their "rated capacity", but you obviously eat all your safety margins immediately.
That's my theory and if I'm right, it'll cost nVidia a pretty penny to fix it as it needs a full re-design.
Regards.