Extremely far apart. Just as AMD and IBM were completely caught off-guard by Intel's aggressive development and adoption of HKMG into production at 45nm, they were even more caught off-guard by the development and adoption of FinFet into production at 22nm.
So what you saw, and continue to see, is IBM and GloFo operating in crisis mode, rushing under-developed process technologies through the R&D pipeline and making ill-advised tradeoffs in the process (bad 32nm dielectric decisions, gate first decision, 28nm disaster, etc).
And they are continuing that tradition with Finfet and 14nm...rushing an underperforming FinFet product (it can only manage enough Idrive to power mobile devices without burning itself up, if they try and power it with enough current and voltage to hit GHz speeds needed for CPUs and GPUs then it dies very quickly) to market for 20nm but re-labeling it a 14nm-XM product because they can't figure out how to rush the 14nm BEOL (metal wiring) to market at the same time.
The gap between Intel and GloFo continues to grow, we see it in their limited release of Finfet for 14nm (mobile only, not high performance) and the lack of scaling in the BEOL. GloFo's 14nm-XM customers will be ill-equipped to field cost or performance competitive parts if those customers are competing with Intel or high-performance customers of TSMC.
Even though TSMC is doing the same shenanigans with the BEOL not shrinking to 16nm, at least they have do intend to field finfet transistors that are robust enough to function (and survive) in the higher voltage and current environment that comes with the MPU version of their 16nm node.
It is difficult to see a silver lining in GloFo's looming dark clouds TBH. Their technology roadmap is not competitive even if they manage to pull it off without delays the likes of which 32nm and 28nm have experienced