One of the biggest strengths of RDRAM is its clock-speed, but this has also been a source of many of its problems. Running at these higher speeds, both RIMMs and motherboards must be manufactured with much more stringent tolerances and with shorter trace lengths to avoid signal corruption from electromagnetic interference (EMI). This adds a double-whammy to the system price. Additionally these factors complicate designing RDRAM systems as demonstrated by Intel with its i820 fiasco.
High speeds create an even greater problem: heat. A single tiny RDRAM chip can consume several Watts of power making the device very, very hot very, very quickly. In fact, the chip could quickly burn up if this heat is not siphoned away. Due to this, RIMMs are most often manufactured wrapped in a metal heat sink. It is also recommended that a fan blow directly across RIMMs to help dissipate this excess heat.
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Heat IS an Issue
Despite the new arguments to the contrary, heat IS an issue. RDRAM and its controlling chipsets have elaborate thermal regulating circuitry to insure that no device overheats. According to Paul DeMone <http://www.realworldtech.com/page.cfm?ArticleID=RWT112299000000&PageNum=4>, a respected expert on memory technologies, when pages are open on an RDAM device, the single tiny RDRAM chip can consume nearly 4W! Obviously the little chip could burn up quickly if not properly cooled.
Unlike SDRAM, this heat can be concentrated into a single chip. As a remedy RDRAM has a special heat sink so that the heat from one chip can be pulled away and dissipated across the heat sink as well as the other chips it comes in contact with (as with most heat sinks, each chip has a thermal interface to insure efficient heat transfer, so in actuality the heat sink does not truly touch the RDRAM - that would be ineffective).
If there wasn't a problem with heat, then RIMM's would not come with the pricey heat sink attached to them. This heat sink is also called a heat spreader, but understand that the later is a subset of the former, despite strange arguments to the contrary <http://www.anandtech.com/showdoc.html?i=1239&p=8>.
A Hot Tradeoff: Performance vs. Energy Consumption
Open pages can be viewed as tiny caches on RAM devices. RDRAM is capable of having more open pages than SDRAM, which should help it latency wise, but in actuality a page read in RDRAM has a hit comparable to bank read latency on SDRAM. Additionally, as stated above, an active RDRAM device consumes a lot of power and gets hot quickly.
So there is a tradeoff: more open pages, higher energy consumption, more heat (and possibly less stability), but better performance, versus fewer open pages, less energy consumption and less heat, but also poorer performance. The current RDRAM systems are performing a careful balancing act, and the heat sink is the balancing pole that allows RDRAM to run a little faster across this tightrope to improve performance.
//www6.tomshardware.com/mainboard/0...little bit of knowledge is a dangerous thing!